400-863-9100

Centerline Technologies LLC(美国)

https://www.centerlinetech-usa.com

地址:
577 Main St. Suite 270 Hudson, MA 01749-3096 United States
电话:
+1 978-568-1330
传真:
+1 978-568-1334
产品:
研磨抛光机  激光加工 

公司简介

Centerline Technologies was founded in 2005 by Hugh Muffoletto to meet the growing demand for high-quality, ultra-precision surface finishing in the telecommunication, semiconductor, communication, micro-electronic, defense and security markets.


技术能力

Lapping

Centerline Lapping








Customizable processes to meet specific needs. We use both single sided polishing and double sided applications.

Polishing

Polishing Substrates

Centerline provides both mechanical and CMP (chemical mechanical process) polishing techniques depending on the customer’s requirements.

Filled Via Planarity

Filled Via

Centerline can make filled vias co-planar with the surface of the substrate using either a one or two step process.

Wafer Dicing

Diamond Sawing

Centerline Technologies is capable of scribing or dicing a variety of shaped parts and finishing with diamond machined edges, bevels and chamfers. 

Laser Machining

Laser machining on ceramics

Centerline's laser machining services size the jobs according to specifications.

Specialty Processes

Centerline Specialty processes

For all unique or difficult projects, Centerline works to find the right processes.


产品列表

Alumina (99.6%, 99.5%, 96% & Black)

BeO

Aluminum Nitride (AIN)

Fused Silica / Quartz

Sapphire

Materion CDDP-10

分享到 :